By Don E Bray; American Ceramic Society.; Wiley InterScience (Online service)
Read or Download 22nd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures A[-B] : January 20-24, 1998, Cocoa Beach, Florida PDF
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Extra resources for 22nd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures A[-B] : January 20-24, 1998, Cocoa Beach, Florida
D) shows a dissolution characteristics of damaged layer in HF (e) A square structure after being transferred from the damaged layer (scratched area) using anisotropic wet etching in KOH. However, this critical tip force may differ from that under other experimental conditions, because the shape of tip-end is not uniform. Finally, a large number of partially overlapped parallel protuberances, formed by continuous machining with a given pitch under low normal load, make the processed area protruded about ~10nm in height as shown in Fig.
7 Final roundness vs. Vp-p, δ , Vf The roundness obtained for different amplitudes of voltage Vp-p applied to the PZT, stock removals δ and worktable feed rates Vf are shown in Figs. 7(a), (b) and (c), respectively. It can be seen 22 Advances in Materials Manufacturing Science and Technology XIII Volume I from Fig. 038µm as the voltage Vp-p increased from 30V to 120V, meaning a better roundness can be obtained at a higher rotational speed of workpiece since the workpiece rotational speed increases with the increasing amplitude of voltage applied (see Table 1).
The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano machining tool. According to our results, it has been clearly known that the damaged layer withstands against aqueous potassium hydroxide solution, while it dissolves in diluted hydro fluoric (DHF) solution. Introduction Many modern technical products rely on manufacturing techniques that produce structures in the micron to nanometer range with a high degree of precision.